Place one pound of wafers in a double boiler over hot, not boiling, water. Stir until melted. Keep water away from product. Keep the water at a temperature between 130–150 degrees F. Water at that temperature will be hot enough to melt the coating but not hot enough to burn your hand if touched. Melt product slowly to 115-120 degrees F. Stir product frequently. Prevent all moisture (steam vapor) from contacting product.
Cool product to 92–98 degrees F and mold using clean, dry molds. Molds should be at room temperature, not cold- er than 70 degrees F. Stir several times whenever you are melting or cooling product so that your temperatures are ac- curate and to prevent streaky results. (Hint: Heating at too high of heat or the addition of any water will destroy the coating.) If coating is too thick after melt- ing process, do not increase temperature or add water. Simply add a small amount of lecithin to thin to the proper consisten- cy. Another method to thin is to add para- mount crystals; but do not exceed a 5% level. Remember never to heat or cool product without stirring.
